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DIMA HP-100

Cycle time: 1.16s/QFP with Area CCD camera, 0. 85s/chip with Closed Loop Electromechanical Alignment, optimal placement rate: 3125 on IPC 9850 with Area SCC & LCC cameras, 4200 on IPC 9850 with CLEA, nominal placement rate: 2500-3500cph (components per hour), processable component types: 0201-Chip, MELF, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, µBGA, LCC, field size: 42x42mm, fine pitch: Up to 0.4mm (16 mil), Tool change station: 12 nozzle positions, Heads: single gantry with two independently controlled pipettes, Assembly accuracy (X/Y) 3σ: 50µ with Area CCD camera,100µ with Closed Loop Electromechanical Alignment, PCB dimensions (X/Y): 30-330x30-450mm, PCB alignment: fiducial detection by ESI CorrectPlace® incl. Teach-in for drill holes or unusual contours, loading and alignment time: approx. 2.8s, number of axes: 2, length: 1700mm, width: 1500mm, height: 2200mm, weight: 450kg without feeder. On-site inspection is possible.
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